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> Accretech tokyo seimitsu part with tip 4GP
Accretech tokyo seimitsu part with tip 4GP
Accretech Tokyo Seimitsu Part with Tip Marked 4GP
According to our research Accretech Tokyo Seimitsu manufactures Semiconductor manufacturing equipment: Wafer probing machines, wafer dicing machines, wafer inspection system, polish grinders, chemical mechanical planarizers (CMPs), wire slicing machines*, wafer slicing machines, wafer edge grinding machines and Measuring instruments: Coordinate measuring machines, surface texture and contour measuring instruments, roundness and cylindrical profile measuring instruments, optical parts and measuring instruments.
We are not sure what system this part is designed for. Hope someone recognizes it and can put it to use. Please write with questions. If someone recognizes this part, we will update the listing.
Let's do the time-warp again !
